Japan's renowned "Asahi Shimbun" reports that the Japanese government initiated export control measures for semiconductor manufacturing equipment on July 23. These measures align with the United States' strategy of tightening restrictions on China. However, China's Ministry of Commerce has expressed concerns that Japan's new regulations fail to accommodate the legitimate needs of the industry and could have severe repercussions on both Chinese and Japanese companies, threatening Sino-Japanese economic and trade collaboration as well as the global semiconductor industry structure and stability.
In late March, Japan announced plans to amend the Foreign Exchange and Foreign Trade Law, aiming to strengthen export controls on 23 types of high-performance semiconductor manufacturing equipment across six categories. The objective of this amendment is to closely cooperate with the United States in preventing technology outflow to China and potential military exploitation. The Ministry of Economy, Trade, and Industry specified that the restricted categories include cleaning, thin film deposition, heat treatment, etching, and inspection. The Japanese government introduced these export control measures on May 23, and they came into effect on July 23.
Yasutoshi Nishimura, Japanese Minister of Economy, Trade, and Industry, has stated that the export controls are "not targeting a specific country." However, public opinion suggests that these measures are aimed at China, considering recent global trends in semiconductor manufacturing equipment export control regulations. The "Nihon Keizai Shimbun" has reported that despite being referred to as an "independent measure," it is in sync with the United States' approach. In response to the proposed amendment to the Foreign Exchange and Foreign Trade Law, the China Council for the Promotion of International Trade, the China Chamber of Commerce for Machinery and Electronics, and the China Chamber of International Commerce have released statements firmly opposing Japan's actions.