NXP Semiconductors recently announced a series of top-cooled RF amplifier modules that leverage innovative packaging techniques to create thinner and lighter wireless products for 5G infrastructure. This smaller base station not only improves the convenience and economy of installation, but also better integrates into the environment. NXP’s family of GaN multi-chip modules combined with a new topside cooling solution not only reduces the thickness and weight of wireless products by more than 20%, but also reduces the environmental impact of 5G base station manufacturing and deployment.
Pierre Piel, vice president and general manager of NXP's RF Power business unit, said: "Top cooling technology presents a huge opportunity for the wireless infrastructure industry. Using this technology, we can combine high power capabilities with excellent thermal performance to create Smaller size RF subsystems. Through the application of this innovative technology, we can not only deploy more environmentally friendly base stations, but also meet the network density required to realize the full performance advantages of 5G."
NXP's new top-cooled devices offer significant design and manufacturing advantages such as no need for dedicated RF shielding, cost-effective use of thinner printed circuit boards, and separate thermal management and RF design. These features help network solution providers create thinner and lighter 5G wireless products for mobile network operators, while shortening the overall product design cycle.
NXP's first family of top-cooled RF power modules is designed for 32T32R, 200W RF, covering the 3.3GHz to 3.8GHz frequency range. The module adopts NXP's own LDMOS and GaN semiconductor technology, which has high gain, high efficiency and broadband performance, and provides a gain of 31 dB and an efficiency of 46% at an instantaneous bandwidth of 400MHz.
The A5M34TG140-TC, A5M35TG140-TC and A5M36TG140-TC are already available, and NXP's family of RapidRF reference boards will support the A5M36TG140-TC. These reference boards provide a complete RF system design, including RF power amplifiers, filters, RF switches, and control circuits. By using these reference boards, designers can more quickly develop 5G-compliant RF systems and can customize designs as needed.
The introduction of NXP's top-cooled RF amplifier module and RapidRF reference board series will provide mobile network operators with more choices and flexibility, helping them to be more efficient and faster in the deployment of 5G networks. At the same time, the launch of these products has further promoted the development and application of 5G technology, providing users with a faster and more stable wireless communication experience.
In short, the launch of NXP's top-cooled RF power module and RapidRF reference board series provides mobile network operators with thinner, more efficient 5G wireless product solutions, and shortens the product design cycle. The application of these products will promote the development of 5G technology and provide users with a better wireless communication experience.
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