2361-6319-9UA-1902

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Manufacturer Part
2361-6319-9UA-1902
Manufacturer
3M
Description
GRID ZIP 19 X 19
Category
Connectors, Interconnects
Family
Sockets for ICs, Transistors
Series
-
In Stock
53394
Datasheets
-

2361-6319-9UA-1902 Specifications

  • 55b18700f05822c99215921d3c8583b7:Obsolete
  • Type:PGA, ZIF (ZIP)
  • Number of Positions or Pins (Grid):361 (19 x 19)
  • Pitch - Mating:0.100" (2.54mm)
  • Contact Finish - Mating:Gold
  • Contact Finish Thickness - Mating:30.0µin (0.76µm)
  • Contact Material - Mating:Beryllium Copper
  • Mounting Type:Through Hole
  • Features:Closed Frame
  • Termination:Solder
  • Pitch - Post:0.100" (2.54mm)
  • Contact Finish - Post:Gold
  • Contact Finish Thickness - Post:30.0µin (0.76µm)
  • Contact Material - Post:Beryllium Copper
  • Housing Material:Polyethersulfone (PES)
  • Operating Temperature:-55°C ~ 150°C

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