100-008-000

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Manufacturer Part
100-008-000
Manufacturer
3M
Description
CONN IC DIP SOCKET 8POS GOLD
Category
Connectors, Interconnects
Family
Sockets for ICs, Transistors
Series
-
In Stock
0
Datasheets
-

100-008-000 Specifications

  • Series:100
  • Package:Bulk
  • Part Status:Obsolete
  • Type:DIP, 0.3" (7.62mm) Row Spacing
  • Number of Positions or Pins (Grid):8 (2 x 4)
  • Pitch - Mating:0.100" (2.54mm)
  • Contact Finish - Mating:Gold
  • Contact Finish Thickness - Mating:8.00µin (0.203µm)
  • Contact Material - Mating:Beryllium Copper
  • Mounting Type:Through Hole
  • Features:Open Frame
  • Termination:Solder
  • Pitch - Post:0.100" (2.54mm)
  • Contact Finish - Post:Gold
  • Contact Finish Thickness - Post:Flash
  • Contact Material - Post:Brass
  • Housing Material:Polyphenylene Sulfide (PPS), Glass Filled
  • Operating Temperature:-65°C ~ 125°C

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