SIP050-1X23-157BLF

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Manufacturer Part
SIP050-1X23-157BLF
Manufacturer
Storage & Server IO (Amphenol ICC)
Description
CONN SOCKET SIP 23POS TIN
Category
Connectors, Interconnects
Family
Sockets for ICs, Transistors
Series
-
In Stock
0
Datasheets
-

SIP050-1X23-157BLF Specifications

  • Series:SIP050-1x
  • Package:Bulk
  • Part Status:Obsolete
  • Type:SIP
  • Number of Positions or Pins (Grid):23 (1 x 23)
  • Pitch - Mating:0.100" (2.54mm)
  • Contact Finish - Mating:Tin
  • Contact Finish Thickness - Mating:200.0µin (5.08µm)
  • Contact Material - Mating:Beryllium Copper
  • Mounting Type:Through Hole
  • Features:Closed Frame
  • Termination:Solder
  • Pitch - Post:0.100" (2.54mm)
  • Contact Finish - Post:Tin
  • Contact Finish Thickness - Post:200.0µin (5.08µm)
  • Contact Material - Post:Brass
  • Housing Material:Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
  • Operating Temperature:-

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