28-6551-18

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Manufacturer Part
28-6551-18
Manufacturer
Aries Electronics, Inc.
Description
CONN IC DIP SOCKET ZIF 28POS
Category
Connectors, Interconnects
Family
Sockets for ICs, Transistors
Series
-
In Stock
0
Datasheets
-

28-6551-18 Specifications

  • Series:55
  • Package:Bulk
  • Part Status:Active
  • Type:DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
  • Number of Positions or Pins (Grid):28 (2 x 14)
  • Pitch - Mating:0.100" (2.54mm)
  • Contact Finish - Mating:Nickel Boron
  • Contact Finish Thickness - Mating:50.0µin (1.27µm)
  • Contact Material - Mating:Beryllium Nickel
  • Mounting Type:Through Hole
  • Features:Closed Frame
  • Termination:Solder
  • Pitch - Post:0.100" (2.54mm)
  • Contact Finish - Post:Nickel Boron
  • Contact Finish Thickness - Post:50.0µin (1.27µm)
  • Contact Material - Post:Beryllium Nickel
  • Housing Material:Polyetheretherketone (PEEK), Glass Filled
  • Operating Temperature:-55°C ~ 250°C

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