85-PGM11008-11

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Manufacturer Part
85-PGM11008-11
Manufacturer
Aries Electronics, Inc.
Description
CONN SOCKET PGA GOLD
Category
Connectors, Interconnects
Family
Sockets for ICs, Transistors
Series
-
In Stock
0
Datasheets
-

85-PGM11008-11 Specifications

  • Series:PGM
  • Package:Bulk
  • Part Status:Active
  • Type:PGA
  • Number of Positions or Pins (Grid):-
  • Pitch - Mating:0.100" (2.54mm)
  • Contact Finish - Mating:Gold
  • Contact Finish Thickness - Mating:10.0µin (0.25µm)
  • Contact Material - Mating:Beryllium Copper
  • Mounting Type:Through Hole
  • Features:-
  • Termination:Solder
  • Pitch - Post:0.100" (2.54mm)
  • Contact Finish - Post:Gold
  • Contact Finish Thickness - Post:10.0µin (0.25µm)
  • Contact Material - Post:Brass
  • Housing Material:Polyamide (PA46), Nylon 4/6, Glass Filled
  • Operating Temperature:-55°C ~ 125°C

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