36-3575-18

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Manufacturer Part
36-3575-18
Manufacturer
Aries Electronics, Inc.
Description
CONN IC DIP SOCKET ZIF 36POS TIN
Category
Connectors, Interconnects
Family
Sockets for ICs, Transistors
Series
-
In Stock
0
Datasheets
-

36-3575-18 Specifications

  • Series:57
  • Package:Bulk
  • Part Status:Active
  • Type:DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
  • Number of Positions or Pins (Grid):36 (2 x 18)
  • Pitch - Mating:0.100" (2.54mm)
  • Contact Finish - Mating:Tin
  • Contact Finish Thickness - Mating:200.0µin (5.08µm)
  • Contact Material - Mating:Beryllium Copper
  • Mounting Type:Through Hole
  • Features:Closed Frame
  • Termination:Solder
  • Pitch - Post:0.100" (2.54mm)
  • Contact Finish - Post:Tin
  • Contact Finish Thickness - Post:200.0µin (5.08µm)
  • Contact Material - Post:Beryllium Copper
  • Housing Material:Polyphenylene Sulfide (PPS), Glass Filled
  • Operating Temperature:-

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