40-6553-11

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Manufacturer Part
40-6553-11
Manufacturer
Aries Electronics, Inc.
Description
CONN IC DIP SOCKET ZIF 40POS
Category
Connectors, Interconnects
Family
Sockets for ICs, Transistors
Series
-
In Stock
0
Datasheets
-

40-6553-11 Specifications

  • Series:55
  • Package:Bulk
  • Part Status:Active
  • Type:DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
  • Number of Positions or Pins (Grid):40 (2 x 20)
  • Pitch - Mating:0.100" (2.54mm)
  • Contact Finish - Mating:Nickel Boron
  • Contact Finish Thickness - Mating:50.0µin (1.27µm)
  • Contact Material - Mating:Beryllium Copper
  • Mounting Type:Through Hole
  • Features:Closed Frame
  • Termination:Solder
  • Pitch - Post:0.100" (2.54mm)
  • Contact Finish - Post:Nickel Boron
  • Contact Finish Thickness - Post:50.0µin (1.27µm)
  • Contact Material - Post:Beryllium Copper
  • Housing Material:Polyphenylene Sulfide (PPS), Glass Filled
  • Operating Temperature:-

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