808-AG10D

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Manufacturer Part
808-AG10D
Manufacturer
TE Connectivity AMP Connectors
Description
CONN IC DIP SOCKET 8POS GOLD
Category
Connectors, Interconnects
Family
Sockets for ICs, Transistors
Series
-
In Stock
2060
Datasheets
-

808-AG10D Specifications

  • Series:800
  • Package:Tube
  • Part Status:Active
  • Type:DIP, 0.3" (7.62mm) Row Spacing
  • Number of Positions or Pins (Grid):8 (2 x 4)
  • Pitch - Mating:0.100" (2.54mm)
  • Contact Finish - Mating:Gold
  • Contact Finish Thickness - Mating:25.0µin (0.63µm)
  • Contact Material - Mating:Copper Alloy
  • Mounting Type:Through Hole
  • Features:Open Frame
  • Termination:Solder
  • Pitch - Post:0.100" (2.54mm)
  • Contact Finish - Post:Gold
  • Contact Finish Thickness - Post:5.00µin (0.127µm)
  • Contact Material - Post:Copper Alloy
  • Housing Material:Polyester
  • Operating Temperature:-55°C ~ 105°C

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